Space businesses are queueing up to get payloads into space. Others are looking to clean up the mess they leave behind.

Archer Materials manufactures first chip that combines the company’s gFET sensors with electrical readout circuitry.

"Advanced packaging is one of the primary vehicles for advancing compute density in AI clusters and cloud," said Will Chu, ...

Aeluma and Thorlabs unveil large-diameter photonics wafer manufacturing platform that could accelerate quantum adoption.

The device has an SPI interface with registers for storing the device configuration as well as internal mapping and PWM ...

TI's technologies will help enable NVIDIA’s 800V DC power-distribution systems for next-generation AI data centres.

The US orders a broad array of companies to stop shipping goods to China without a license including EDA vendors.

Nvidia has once again beaten Wall Street expectations with its quarterly earnings up 69 per cent at over $44bn.

The Thunder Series is available in directional and omnidirectional versions, with IP67-rated ABS enclosures protecting ...

NXP Semiconductors announces the NTAG X DNA, a new Type 4 secure connected NFC tag, enabling secure authentication.

Infineon unveils new family of radiation hardened Gallium Nitride (GaN) transistors, based on its CoolGan technology.

CEO, Van den hove believes future chips will see their capabilities merged into building blocks called supercells.